High-Speed Optical Module Demand Soars: AI
Discovering the intersection of AI computing and escalating market trends, the reliance on optical modules has surged. From high-scale
The Next Big Thing After Optical Modules
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In this scenario, Co-Packaged Optics (CPO) is now gaining momentum, emerging mainly as an alternative to the pluggable optical modules traditionally employed in networking switches ("scale-out" datacenter expansion). Networking unlocks computing capability for single AI chips, connecting multiple chips (working together), enabling seamless data exchange and low latency, and driving AI to the next level. Along with an AI infrastructure ramp-up and rising computing power per rack, Goldman Sachs Research analysts. From chiplets and 3D packaging to HBM bottlenecks, custom AI silicon, automotive electrification, and geopolitically reshaped supply chains, the industry is redefining. By Andreas Thoss The year 2025 is only just now upon us, but it is already facing many concerns: Politics will change (America) or face instability (Europe), and the threat of various conflicts will alter supply chains.